UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper

UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper

Hyperspectral imaging and reflectance spectroscopy in the range from 200–380 nm were used to rapidly detect and characterize copper oxidation states and their layer thicknesses on direct bonded copper in a non-destructive way. Single-point UV reflectance spectroscopy, as a well-established method, w...

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Bibliographic Details
Main Authors: Mohammad Al Ktash, Mona Stefanakis, Tim Englert, Maryam S. L. Drechsel, Jan Stiedl, Simon Green, Timo Jacob, Barbara Boldrini, Edwin Ostertag, Karsten Rebner, Marc Brecht
Format: article
Language:EN
Published: MDPI AG 2021
Subjects:
hyperspectral imaging
pushbroom
UV spectroscopy
principal component analysis
partial least squares regression
direct bonded copper
Chemical technology
TP1-1185
Online Access:https://doaj.org/article/6a85092827184b35ae9c7c442f628be9
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https://doaj.org/article/6a85092827184b35ae9c7c442f628be9

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