Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging
The release of compressive stress and atom diffusion have important influences on the growth of whiskers in 3D electronic packaging, and the compressive stress is also one of the main factors for dynamic recrystallization (DRX). By using the mathematical model of growth mechanism and the behavior of...
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| Main Author: | |
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| Format: | article |
| Language: | ZH |
| Published: |
Editorial Office of Journal of Shanghai Jiao Tong University
2021
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| Online Access: | https://doaj.org/article/6c2c37c46c7e49829560f03f30f9d051 |
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