WANG Zekun, Z. F. (2021). Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging. Editorial Office of Journal of Shanghai Jiao Tong University.
Chicago Style (17th ed.) CitationWANG Zekun, ZHANG Fuxi. Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging. Editorial Office of Journal of Shanghai Jiao Tong University, 2021.
MLA (8th ed.) CitationWANG Zekun, ZHANG Fuxi. Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging. Editorial Office of Journal of Shanghai Jiao Tong University, 2021.
Warning: These citations may not always be 100% accurate.