Cita APA (7a ed.)

WANG Zekun, Z. F. (2021). Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging. Editorial Office of Journal of Shanghai Jiao Tong University.

Cita Chicago Style (17a ed.)

WANG Zekun, ZHANG Fuxi. Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging. Editorial Office of Journal of Shanghai Jiao Tong University, 2021.

Cita MLA (8a ed.)

WANG Zekun, ZHANG Fuxi. Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging. Editorial Office of Journal of Shanghai Jiao Tong University, 2021.