WANG Zekun, Z. F. (2021). Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging. Editorial Office of Journal of Shanghai Jiao Tong University.
Style de citation Chicago (17e éd.)WANG Zekun, ZHANG Fuxi. Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging. Editorial Office of Journal of Shanghai Jiao Tong University, 2021.
Style de citation MLA (8e éd.)WANG Zekun, ZHANG Fuxi. Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging. Editorial Office of Journal of Shanghai Jiao Tong University, 2021.
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