Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging

The release of compressive stress and atom diffusion have important influences on the growth of whiskers in 3D electronic packaging, and the compressive stress is also one of the main factors for dynamic recrystallization (DRX). By using the mathematical model of growth mechanism and the behavior of...

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Auteur principal:	WANG Zekun, ZHANG Fuxi
Format:	article
Langue:	ZH
Publié:	Editorial Office of Journal of Shanghai Jiao Tong University 2021
Sujets:	compressive stress atomic diffusion tin whisker 3d electronic packaging mathematical model accelerated test Engineering (General). Civil engineering (General) TA1-2040 Chemical engineering TP155-156 Naval architecture. Shipbuilding. Marine engineering VM1-989
Accès en ligne:	https://doaj.org/article/6c2c37c46c7e49829560f03f30f9d051
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id	oai:doaj.org-article:6c2c37c46c7e49829560f03f30f9d051
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spelling	oai:doaj.org-article:6c2c37c46c7e49829560f03f30f9d0512021-12-03T02:59:23ZModeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging1006-246710.16183/j.cnki.jsjtu.2021.017https://doaj.org/article/6c2c37c46c7e49829560f03f30f9d0512021-11-01T00:00:00Zhttp://xuebao.sjtu.edu.cn/article/2021/1006-2467/1006-2467-55-11-1445.shtmlhttps://doaj.org/toc/1006-2467The release of compressive stress and atom diffusion have important influences on the growth of whiskers in 3D electronic packaging, and the compressive stress is also one of the main factors for dynamic recrystallization (DRX). By using the mathematical model of growth mechanism and the behavior of tin whisker based on the finite element method, the process of forming whiskers on silicon substrate by 3D electronic packaging tin layer with a typical physical size and structure was simulated. The qualitative analysis and growth of whiskers were realized. By controlling the key parameters such as gas pressure, thermal cycling temperature, and cycle of Ar in the background of the experiment, the external factors and plating process were constructed. The experimental system of accelerated test of internal pressure stress and whisker growth speed, length, and density in the film was constructed. The growth rate and density of whiskers were observed and detected by SEM. The effectiveness of the mathematical model of stress release, atom diffusion, and DRX in 3D electronic packaging tin whiskers was verified by SEM. The quantitative description of whiskers was realized, providing constructive suggestions for reducing whisker problems in future 3D packaging microstructure graphic design.WANG Zekun, ZHANG FuxiEditorial Office of Journal of Shanghai Jiao Tong Universityarticlecompressive stressatomic diffusiontin whisker3d electronic packagingmathematical modelaccelerated testEngineering (General). Civil engineering (General)TA1-2040Chemical engineeringTP155-156Naval architecture. Shipbuilding. Marine engineeringVM1-989ZHShanghai Jiaotong Daxue xuebao, Vol 55, Iss 11, Pp 1445-1452 (2021)
institution	DOAJ
collection	DOAJ
language	ZH
topic	compressive stress atomic diffusion tin whisker 3d electronic packaging mathematical model accelerated test Engineering (General). Civil engineering (General) TA1-2040 Chemical engineering TP155-156 Naval architecture. Shipbuilding. Marine engineering VM1-989
spellingShingle	compressive stress atomic diffusion tin whisker 3d electronic packaging mathematical model accelerated test Engineering (General). Civil engineering (General) TA1-2040 Chemical engineering TP155-156 Naval architecture. Shipbuilding. Marine engineering VM1-989 WANG Zekun, ZHANG Fuxi Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging
description	The release of compressive stress and atom diffusion have important influences on the growth of whiskers in 3D electronic packaging, and the compressive stress is also one of the main factors for dynamic recrystallization (DRX). By using the mathematical model of growth mechanism and the behavior of tin whisker based on the finite element method, the process of forming whiskers on silicon substrate by 3D electronic packaging tin layer with a typical physical size and structure was simulated. The qualitative analysis and growth of whiskers were realized. By controlling the key parameters such as gas pressure, thermal cycling temperature, and cycle of Ar in the background of the experiment, the external factors and plating process were constructed. The experimental system of accelerated test of internal pressure stress and whisker growth speed, length, and density in the film was constructed. The growth rate and density of whiskers were observed and detected by SEM. The effectiveness of the mathematical model of stress release, atom diffusion, and DRX in 3D electronic packaging tin whiskers was verified by SEM. The quantitative description of whiskers was realized, providing constructive suggestions for reducing whisker problems in future 3D packaging microstructure graphic design.
format	article
author	WANG Zekun, ZHANG Fuxi
author_facet	WANG Zekun, ZHANG Fuxi
author_sort	WANG Zekun, ZHANG Fuxi
title	Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging
title_short	Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging
title_full	Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging
title_fullStr	Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging
title_full_unstemmed	Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging
title_sort	modeling and experimental study of tin whiskers for 3d electronic packaging
publisher	Editorial Office of Journal of Shanghai Jiao Tong University
publishDate	2021
url	https://doaj.org/article/6c2c37c46c7e49829560f03f30f9d051
work_keys_str_mv	AT wangzekunzhangfuxi modelingandexperimentalstudyoftinwhiskersfor3delectronicpackaging
_version_	1718373935971565568

Modeling and Experimental Study of Tin Whiskers for 3D Electronic Packaging

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