Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Well-developed prototype interface materials for electronics thermal management are limited to a low thermal conductivity or high elastic modulus. Here, the authors report flexible thermal interfaces through self-assembled manufacturing of polymetric composites based on the high thermal conductivity...

Description complète

Enregistré dans:
Détails bibliographiques
Auteurs principaux: Ying Cui, Zihao Qin, Huan Wu, Man Li, Yongjie Hu
Format: article
Langue:EN
Publié: Nature Portfolio 2021
Sujets:
Q
Accès en ligne:https://doaj.org/article/72aa1a6577aa46f984d4e487aad1e8a6
Tags: Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!