Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Well-developed prototype interface materials for electronics thermal management are limited to a low thermal conductivity or high elastic modulus. Here, the authors report flexible thermal interfaces through self-assembled manufacturing of polymetric composites based on the high thermal conductivity...

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Autores principales:	Ying Cui, Zihao Qin, Huan Wu, Man Li, Yongjie Hu
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Science Q
Acceso en línea:	https://doaj.org/article/72aa1a6577aa46f984d4e487aad1e8a6
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spelling	oai:doaj.org-article:72aa1a6577aa46f984d4e487aad1e8a62021-12-02T13:30:08ZFlexible thermal interface based on self-assembled boron arsenide for high-performance thermal management10.1038/s41467-021-21531-72041-1723https://doaj.org/article/72aa1a6577aa46f984d4e487aad1e8a62021-02-01T00:00:00Zhttps://doi.org/10.1038/s41467-021-21531-7https://doaj.org/toc/2041-1723Well-developed prototype interface materials for electronics thermal management are limited to a low thermal conductivity or high elastic modulus. Here, the authors report flexible thermal interfaces through self-assembled manufacturing of polymetric composites based on the high thermal conductivity of cubic boron arsenide.Ying CuiZihao QinHuan WuMan LiYongjie HuNature PortfolioarticleScienceQENNature Communications, Vol 12, Iss 1, Pp 1-7 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Science Q
spellingShingle	Science Q Ying Cui Zihao Qin Huan Wu Man Li Yongjie Hu Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
description	Well-developed prototype interface materials for electronics thermal management are limited to a low thermal conductivity or high elastic modulus. Here, the authors report flexible thermal interfaces through self-assembled manufacturing of polymetric composites based on the high thermal conductivity of cubic boron arsenide.
format	article
author	Ying Cui Zihao Qin Huan Wu Man Li Yongjie Hu
author_facet	Ying Cui Zihao Qin Huan Wu Man Li Yongjie Hu
author_sort	Ying Cui
title	Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
title_short	Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
title_full	Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
title_fullStr	Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
title_full_unstemmed	Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
title_sort	flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/72aa1a6577aa46f984d4e487aad1e8a6
work_keys_str_mv	AT yingcui flexiblethermalinterfacebasedonselfassembledboronarsenideforhighperformancethermalmanagement AT zihaoqin flexiblethermalinterfacebasedonselfassembledboronarsenideforhighperformancethermalmanagement AT huanwu flexiblethermalinterfacebasedonselfassembledboronarsenideforhighperformancethermalmanagement AT manli flexiblethermalinterfacebasedonselfassembledboronarsenideforhighperformancethermalmanagement AT yongjiehu flexiblethermalinterfacebasedonselfassembledboronarsenideforhighperformancethermalmanagement
_version_	1718392981151547392

Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

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