Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Well-developed prototype interface materials for electronics thermal management are limited to a low thermal conductivity or high elastic modulus. Here, the authors report flexible thermal interfaces through self-assembled manufacturing of polymetric composites based on the high thermal conductivity...

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Autores principales: Ying Cui, Zihao Qin, Huan Wu, Man Li, Yongjie Hu
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2021
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Acceso en línea:https://doaj.org/article/72aa1a6577aa46f984d4e487aad1e8a6
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