Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
Well-developed prototype interface materials for electronics thermal management are limited to a low thermal conductivity or high elastic modulus. Here, the authors report flexible thermal interfaces through self-assembled manufacturing of polymetric composites based on the high thermal conductivity...
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Main Authors: | Ying Cui, Zihao Qin, Huan Wu, Man Li, Yongjie Hu |
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Format: | article |
Language: | EN |
Published: |
Nature Portfolio
2021
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Subjects: | |
Online Access: | https://doaj.org/article/72aa1a6577aa46f984d4e487aad1e8a6 |
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