Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management
Well-developed prototype interface materials for electronics thermal management are limited to a low thermal conductivity or high elastic modulus. Here, the authors report flexible thermal interfaces through self-assembled manufacturing of polymetric composites based on the high thermal conductivity...
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| Auteurs principaux: | , , , , |
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| Format: | article |
| Langue: | EN |
| Publié: |
Nature Portfolio
2021
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| Sujets: | |
| Accès en ligne: | https://doaj.org/article/72aa1a6577aa46f984d4e487aad1e8a6 |
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