Nano- and microscratching as a potential method for texturing the Si surface
The possibility of Si texturing through the use of nano- and microscratching with subsequent chemical etching has been investigated. The influence of the scratching speed, orientation of the indenter (face-on, edge-on) and normal load on the mechanism of deformation during scratching has been analyz...
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| Autores principales: | , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
D.Ghitu Institute of Electronic Engineering and Nanotechnologies
2014
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/777fca9c3662401a8716c0f834a44d87 |
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