Nano- and microscratching as a potential method for texturing the Si surface

The possibility of Si texturing through the use of nano- and microscratching with subsequent chemical etching has been investigated. The influence of the scratching speed, orientation of the indenter (face-on, edge-on) and normal load on the mechanism of deformation during scratching has been analyz...

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Autores principales:	Prisăcaru, Andrian, Şikimaka, Olga, Harea, Evghenii, Burlacu, Alexandru, Enachi, Mihail, Branişte, Fiodor
Formato:	article
Lenguaje:	EN
Publicado:	D.Ghitu Institute of Electronic Engineering and Nanotechnologies 2014
Materias:	Physics QC1-999 Electronics TK7800-8360
Acceso en línea:	https://doaj.org/article/777fca9c3662401a8716c0f834a44d87
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spelling	oai:doaj.org-article:777fca9c3662401a8716c0f834a44d872021-11-21T11:58:57ZNano- and microscratching as a potential method for texturing the Si surface539.2+544.6+621.3832537-63651810-648Xhttps://doaj.org/article/777fca9c3662401a8716c0f834a44d872014-12-01T00:00:00Zhttps://mjps.nanotech.md/archive/2014/article/39446https://doaj.org/toc/1810-648Xhttps://doaj.org/toc/2537-6365The possibility of Si texturing through the use of nano- and microscratching with subsequent chemical etching has been investigated. The influence of the scratching speed, orientation of the indenter (face-on, edge-on) and normal load on the mechanism of deformation during scratching has been analyzed to reveal the favorable loading conditions to obtain plastic scratches. It has been found that the surface of scratches has a corrugated structure that was assumed to be the result of the stick-slip behavior during scratching. Different etching patterns displayed after chemical etching, such as inverse pyramids and a lamellar structure, have been attributed to the specific initial relief of the scratches and etching conditions.Prisăcaru, AndrianŞikimaka, OlgaHarea, EvgheniiBurlacu, AlexandruEnachi, MihailBranişte, FiodorD.Ghitu Institute of Electronic Engineering and NanotechnologiesarticlePhysicsQC1-999ElectronicsTK7800-8360ENMoldavian Journal of the Physical Sciences, Vol 13, Iss 3-4, Pp 188-194 (2014)
institution	DOAJ
collection	DOAJ
language	EN
topic	Physics QC1-999 Electronics TK7800-8360
spellingShingle	Physics QC1-999 Electronics TK7800-8360 Prisăcaru, Andrian Şikimaka, Olga Harea, Evghenii Burlacu, Alexandru Enachi, Mihail Branişte, Fiodor Nano- and microscratching as a potential method for texturing the Si surface
description	The possibility of Si texturing through the use of nano- and microscratching with subsequent chemical etching has been investigated. The influence of the scratching speed, orientation of the indenter (face-on, edge-on) and normal load on the mechanism of deformation during scratching has been analyzed to reveal the favorable loading conditions to obtain plastic scratches. It has been found that the surface of scratches has a corrugated structure that was assumed to be the result of the stick-slip behavior during scratching. Different etching patterns displayed after chemical etching, such as inverse pyramids and a lamellar structure, have been attributed to the specific initial relief of the scratches and etching conditions.
format	article
author	Prisăcaru, Andrian Şikimaka, Olga Harea, Evghenii Burlacu, Alexandru Enachi, Mihail Branişte, Fiodor
author_facet	Prisăcaru, Andrian Şikimaka, Olga Harea, Evghenii Burlacu, Alexandru Enachi, Mihail Branişte, Fiodor
author_sort	Prisăcaru, Andrian
title	Nano- and microscratching as a potential method for texturing the Si surface
title_short	Nano- and microscratching as a potential method for texturing the Si surface
title_full	Nano- and microscratching as a potential method for texturing the Si surface
title_fullStr	Nano- and microscratching as a potential method for texturing the Si surface
title_full_unstemmed	Nano- and microscratching as a potential method for texturing the Si surface
title_sort	nano- and microscratching as a potential method for texturing the si surface
publisher	D.Ghitu Institute of Electronic Engineering and Nanotechnologies
publishDate	2014
url	https://doaj.org/article/777fca9c3662401a8716c0f834a44d87
work_keys_str_mv	AT prisacaruandrian nanoandmicroscratchingasapotentialmethodfortexturingthesisurface AT sikimakaolga nanoandmicroscratchingasapotentialmethodfortexturingthesisurface AT hareaevghenii nanoandmicroscratchingasapotentialmethodfortexturingthesisurface AT burlacualexandru nanoandmicroscratchingasapotentialmethodfortexturingthesisurface AT enachimihail nanoandmicroscratchingasapotentialmethodfortexturingthesisurface AT branistefiodor nanoandmicroscratchingasapotentialmethodfortexturingthesisurface
_version_	1718419313166123008

Nano- and microscratching as a potential method for texturing the Si surface

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