Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure

The crack growth resistance under thermal shock loading on silicon nitride was characterized using Disc-on-Rod test which was developed by the authors. The microdamage during thermal shock fracture was monitored by acoustic emission (AE) technique. Specimens were composed of β-Si3N4 with an acicular...

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Autores principales:	Takenobu SAKAI, Shuichi WAKAYAMA, Go KAMETANI, Katsumi YOSHIDA, Takashi AKATSU
Formato:	article
Lenguaje:	EN
Publicado:	The Japan Society of Mechanical Engineers 2014
Materias:	silicon nitride thermal shock fracture crack growth resistance disc-on-rod test thermal stress acoustic emission Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/7b4cea3acdf948d398b01a6f1bbf27e8
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spelling	oai:doaj.org-article:7b4cea3acdf948d398b01a6f1bbf27e82021-11-26T06:01:53ZCharacterization of crack growth resistance under thermal shock on silicon nitride with various microstructure2187-974510.1299/mej.2014smm0002https://doaj.org/article/7b4cea3acdf948d398b01a6f1bbf27e82014-02-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/mej/1/1/1_2014smm0002/_pdf/-char/enhttps://doaj.org/toc/2187-9745The crack growth resistance under thermal shock loading on silicon nitride was characterized using Disc-on-Rod test which was developed by the authors. The microdamage during thermal shock fracture was monitored by acoustic emission (AE) technique. Specimens were composed of β-Si3N4 with an acicular structure. Cylinders of silicon nitride with various microstructures were sintered at different temperatures. A pre-crack was introduced using Knoop indentation. In the Disc-on-Rod test, the specimens were uniformly heated to 850 ºC, and only the center of circular specimen was quenched by contacting with a copper rod. Within a fraction of a second after contacting, crack propagated in an unstable manner, at the same time, a high amplitude AE signal was detected. Subsequently, stable crack propagation was observed, and several low amplitude AE signals were generated corresponding to crack propagation. The specimen sintered at higher temperature showed lower crack growth resistance. From the results of microstructure observation and the fracture mechanical consideration, it is suggested that larger grains with > 1.5 μm in minor axes contribute to the toughening of materials. Consequently, the results of this study provide fundamental insights for the development of ceramic materials with high resistance to thermal shock fracture.Takenobu SAKAIShuichi WAKAYAMAGo KAMETANIKatsumi YOSHIDATakashi AKATSUThe Japan Society of Mechanical Engineersarticlesilicon nitridethermal shock fracturecrack growth resistancedisc-on-rod testthermal stressacoustic emissionMechanical engineering and machineryTJ1-1570ENMechanical Engineering Journal, Vol 1, Iss 1, Pp SMM0002-SMM0002 (2014)
institution	DOAJ
collection	DOAJ
language	EN
topic	silicon nitride thermal shock fracture crack growth resistance disc-on-rod test thermal stress acoustic emission Mechanical engineering and machinery TJ1-1570
spellingShingle	silicon nitride thermal shock fracture crack growth resistance disc-on-rod test thermal stress acoustic emission Mechanical engineering and machinery TJ1-1570 Takenobu SAKAI Shuichi WAKAYAMA Go KAMETANI Katsumi YOSHIDA Takashi AKATSU Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure
description	The crack growth resistance under thermal shock loading on silicon nitride was characterized using Disc-on-Rod test which was developed by the authors. The microdamage during thermal shock fracture was monitored by acoustic emission (AE) technique. Specimens were composed of β-Si3N4 with an acicular structure. Cylinders of silicon nitride with various microstructures were sintered at different temperatures. A pre-crack was introduced using Knoop indentation. In the Disc-on-Rod test, the specimens were uniformly heated to 850 ºC, and only the center of circular specimen was quenched by contacting with a copper rod. Within a fraction of a second after contacting, crack propagated in an unstable manner, at the same time, a high amplitude AE signal was detected. Subsequently, stable crack propagation was observed, and several low amplitude AE signals were generated corresponding to crack propagation. The specimen sintered at higher temperature showed lower crack growth resistance. From the results of microstructure observation and the fracture mechanical consideration, it is suggested that larger grains with > 1.5 μm in minor axes contribute to the toughening of materials. Consequently, the results of this study provide fundamental insights for the development of ceramic materials with high resistance to thermal shock fracture.
format	article
author	Takenobu SAKAI Shuichi WAKAYAMA Go KAMETANI Katsumi YOSHIDA Takashi AKATSU
author_facet	Takenobu SAKAI Shuichi WAKAYAMA Go KAMETANI Katsumi YOSHIDA Takashi AKATSU
author_sort	Takenobu SAKAI
title	Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure
title_short	Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure
title_full	Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure
title_fullStr	Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure
title_full_unstemmed	Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure
title_sort	characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure
publisher	The Japan Society of Mechanical Engineers
publishDate	2014
url	https://doaj.org/article/7b4cea3acdf948d398b01a6f1bbf27e8
work_keys_str_mv	AT takenobusakai characterizationofcrackgrowthresistanceunderthermalshockonsiliconnitridewithvariousmicrostructure AT shuichiwakayama characterizationofcrackgrowthresistanceunderthermalshockonsiliconnitridewithvariousmicrostructure AT gokametani characterizationofcrackgrowthresistanceunderthermalshockonsiliconnitridewithvariousmicrostructure AT katsumiyoshida characterizationofcrackgrowthresistanceunderthermalshockonsiliconnitridewithvariousmicrostructure AT takashiakatsu characterizationofcrackgrowthresistanceunderthermalshockonsiliconnitridewithvariousmicrostructure
_version_	1718409785332727808

Characterization of crack growth resistance under thermal shock on silicon nitride with various microstructure

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