High-resolution patterning of solution-processable materials via externally engineered pinning of capillary bridges

Solution-processed electronics is desirable for large-scale electronics, but it is challenging to fabricate nanometre patterns via liquid processes. Li et al. address this problem using soft molds with groove and ridge structures, which control thin-film morphology upon dying via the pinning effect.

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Autores principales: Shunpu Li, Young Tea Chun, Shuo Zhao, Hyungju Ahn, Docheon Ahn, Jung Inn Sohn, Yongbing Xu, Pawan Shrestha, Mike Pivnenko, Daping Chu
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2018
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Acceso en línea:https://doaj.org/article/7e092d8a548a4d7a81823db908169d40
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