High-resolution patterning of solution-processable materials via externally engineered pinning of capillary bridges
Solution-processed electronics is desirable for large-scale electronics, but it is challenging to fabricate nanometre patterns via liquid processes. Li et al. address this problem using soft molds with groove and ridge structures, which control thin-film morphology upon dying via the pinning effect.
Guardado en:
Autores principales: | Shunpu Li, Young Tea Chun, Shuo Zhao, Hyungju Ahn, Docheon Ahn, Jung Inn Sohn, Yongbing Xu, Pawan Shrestha, Mike Pivnenko, Daping Chu |
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Formato: | article |
Lenguaje: | EN |
Publicado: |
Nature Portfolio
2018
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Materias: | |
Acceso en línea: | https://doaj.org/article/7e092d8a548a4d7a81823db908169d40 |
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