Evaporation Effect on Thickness Distribution for Spin-Coated Films on Rectangular and Circular Substrates

Spin-coating is widely applied in the field of thin-film fabrication due to its simplicity and high film uniformity. To prepare thin films on rectangular substrates by spin-coating, the simulation and experimental methods were used to study the characteristics of the film thickness in this work. The...

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Autores principales: Ying Yan, Jiarun Li, Qiuyu Liu, Ping Zhou
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/870ecc9fe41047c4b81e0269332f4ea6
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spelling oai:doaj.org-article:870ecc9fe41047c4b81e0269332f4ea62021-11-25T17:16:01ZEvaporation Effect on Thickness Distribution for Spin-Coated Films on Rectangular and Circular Substrates10.3390/coatings111113222079-6412https://doaj.org/article/870ecc9fe41047c4b81e0269332f4ea62021-10-01T00:00:00Zhttps://www.mdpi.com/2079-6412/11/11/1322https://doaj.org/toc/2079-6412Spin-coating is widely applied in the field of thin-film fabrication due to its simplicity and high film uniformity. To prepare thin films on rectangular substrates by spin-coating, the simulation and experimental methods were used to study the characteristics of the film thickness in this work. The two-phase flow simulations of spin-coating on a rectangular substrate and circular substrate were carried out with the volume of fluid (VOF) method. The simulation results showed that the airflow field and the substrate geometry had little effect on the evolution of spin-coated film thickness. However, in the experimental results, there was a significant difference in the thickness of the spin-coated film on the rectangular substrate and the circular substrate. According to further study, the solvent evaporation that was neglected in the simulation was the dominant factor of the differences. In addition, it was concluded that the non-uniform evaporation caused by the surface tension and edge accumulation in the later spin-coating stage was the main reason for the film accumulation of the windward area on the rectangular substrate. This work is useful to obtain a deeper understanding of the thin-film formation mechanism of spin-coating.Ying YanJiarun LiQiuyu LiuPing ZhouMDPI AGarticlespin-coatingrectangular substratefilm thickness distributiontwo-phase flowsolvent evaporationEngineering (General). Civil engineering (General)TA1-2040ENCoatings, Vol 11, Iss 1322, p 1322 (2021)
institution DOAJ
collection DOAJ
language EN
topic spin-coating
rectangular substrate
film thickness distribution
two-phase flow
solvent evaporation
Engineering (General). Civil engineering (General)
TA1-2040
spellingShingle spin-coating
rectangular substrate
film thickness distribution
two-phase flow
solvent evaporation
Engineering (General). Civil engineering (General)
TA1-2040
Ying Yan
Jiarun Li
Qiuyu Liu
Ping Zhou
Evaporation Effect on Thickness Distribution for Spin-Coated Films on Rectangular and Circular Substrates
description Spin-coating is widely applied in the field of thin-film fabrication due to its simplicity and high film uniformity. To prepare thin films on rectangular substrates by spin-coating, the simulation and experimental methods were used to study the characteristics of the film thickness in this work. The two-phase flow simulations of spin-coating on a rectangular substrate and circular substrate were carried out with the volume of fluid (VOF) method. The simulation results showed that the airflow field and the substrate geometry had little effect on the evolution of spin-coated film thickness. However, in the experimental results, there was a significant difference in the thickness of the spin-coated film on the rectangular substrate and the circular substrate. According to further study, the solvent evaporation that was neglected in the simulation was the dominant factor of the differences. In addition, it was concluded that the non-uniform evaporation caused by the surface tension and edge accumulation in the later spin-coating stage was the main reason for the film accumulation of the windward area on the rectangular substrate. This work is useful to obtain a deeper understanding of the thin-film formation mechanism of spin-coating.
format article
author Ying Yan
Jiarun Li
Qiuyu Liu
Ping Zhou
author_facet Ying Yan
Jiarun Li
Qiuyu Liu
Ping Zhou
author_sort Ying Yan
title Evaporation Effect on Thickness Distribution for Spin-Coated Films on Rectangular and Circular Substrates
title_short Evaporation Effect on Thickness Distribution for Spin-Coated Films on Rectangular and Circular Substrates
title_full Evaporation Effect on Thickness Distribution for Spin-Coated Films on Rectangular and Circular Substrates
title_fullStr Evaporation Effect on Thickness Distribution for Spin-Coated Films on Rectangular and Circular Substrates
title_full_unstemmed Evaporation Effect on Thickness Distribution for Spin-Coated Films on Rectangular and Circular Substrates
title_sort evaporation effect on thickness distribution for spin-coated films on rectangular and circular substrates
publisher MDPI AG
publishDate 2021
url https://doaj.org/article/870ecc9fe41047c4b81e0269332f4ea6
work_keys_str_mv AT yingyan evaporationeffectonthicknessdistributionforspincoatedfilmsonrectangularandcircularsubstrates
AT jiarunli evaporationeffectonthicknessdistributionforspincoatedfilmsonrectangularandcircularsubstrates
AT qiuyuliu evaporationeffectonthicknessdistributionforspincoatedfilmsonrectangularandcircularsubstrates
AT pingzhou evaporationeffectonthicknessdistributionforspincoatedfilmsonrectangularandcircularsubstrates
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