Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
The existing integration approaches for 2D materials often degrade material properties and are not compatible with industrial processing. Here, the authors devise an adhesive wafer bonding strategy to transfer and stack monolayers, suitable for back end of the line integration of 2D materials.
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Nature Portfolio
2021
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| Acceso en línea: | https://doaj.org/article/8af99583e0ae4934b663750930c1b923 |
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oai:doaj.org-article:8af99583e0ae4934b663750930c1b9232021-12-02T13:30:25ZLarge-area integration of two-dimensional materials and their heterostructures by wafer bonding10.1038/s41467-021-21136-02041-1723https://doaj.org/article/8af99583e0ae4934b663750930c1b9232021-02-01T00:00:00Zhttps://doi.org/10.1038/s41467-021-21136-0https://doaj.org/toc/2041-1723The existing integration approaches for 2D materials often degrade material properties and are not compatible with industrial processing. Here, the authors devise an adhesive wafer bonding strategy to transfer and stack monolayers, suitable for back end of the line integration of 2D materials.Arne QuellmalzXiaojing WangSimon SawallichBurkay UzluMartin OttoStefan WagnerZhenxing WangMaximilian PrechtlOliver HartwigSiwei LuoGeorg S. DuesbergMax C. LemmeKristinn B. GylfasonNiclas RoxhedGöran StemmeFrank NiklausNature PortfolioarticleScienceQENNature Communications, Vol 12, Iss 1, Pp 1-11 (2021) |
| institution |
DOAJ |
| collection |
DOAJ |
| language |
EN |
| topic |
Science Q |
| spellingShingle |
Science Q Arne Quellmalz Xiaojing Wang Simon Sawallich Burkay Uzlu Martin Otto Stefan Wagner Zhenxing Wang Maximilian Prechtl Oliver Hartwig Siwei Luo Georg S. Duesberg Max C. Lemme Kristinn B. Gylfason Niclas Roxhed Göran Stemme Frank Niklaus Large-area integration of two-dimensional materials and their heterostructures by wafer bonding |
| description |
The existing integration approaches for 2D materials often degrade material properties and are not compatible with industrial processing. Here, the authors devise an adhesive wafer bonding strategy to transfer and stack monolayers, suitable for back end of the line integration of 2D materials. |
| format |
article |
| author |
Arne Quellmalz Xiaojing Wang Simon Sawallich Burkay Uzlu Martin Otto Stefan Wagner Zhenxing Wang Maximilian Prechtl Oliver Hartwig Siwei Luo Georg S. Duesberg Max C. Lemme Kristinn B. Gylfason Niclas Roxhed Göran Stemme Frank Niklaus |
| author_facet |
Arne Quellmalz Xiaojing Wang Simon Sawallich Burkay Uzlu Martin Otto Stefan Wagner Zhenxing Wang Maximilian Prechtl Oliver Hartwig Siwei Luo Georg S. Duesberg Max C. Lemme Kristinn B. Gylfason Niclas Roxhed Göran Stemme Frank Niklaus |
| author_sort |
Arne Quellmalz |
| title |
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding |
| title_short |
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding |
| title_full |
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding |
| title_fullStr |
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding |
| title_full_unstemmed |
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding |
| title_sort |
large-area integration of two-dimensional materials and their heterostructures by wafer bonding |
| publisher |
Nature Portfolio |
| publishDate |
2021 |
| url |
https://doaj.org/article/8af99583e0ae4934b663750930c1b923 |
| work_keys_str_mv |
AT arnequellmalz largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT xiaojingwang largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT simonsawallich largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT burkayuzlu largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT martinotto largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT stefanwagner largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT zhenxingwang largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT maximilianprechtl largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT oliverhartwig largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT siweiluo largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT georgsduesberg largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT maxclemme largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT kristinnbgylfason largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT niclasroxhed largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT goranstemme largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding AT frankniklaus largeareaintegrationoftwodimensionalmaterialsandtheirheterostructuresbywaferbonding |
| _version_ |
1718392927474941952 |