Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing

Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing

Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of...

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Detalles Bibliográficos
Autores principales: Paweł Kozłowski, Krzysztof Czuba, Krzysztof Chmielewski, Jacek Ratajczak, Joanna Branas, Adam Korczyc, Kazimierz Regiński, Agata Jasik
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
Materias:
infrared photodetectors
thermal evaporation
metallization
wet etching
indium bumps
annealing
Technology
T
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Engineering (General). Civil engineering (General)
TA1-2040
Microscopy
QH201-278.5
Descriptive and experimental mechanics
QC120-168.85
Acceso en línea:https://doaj.org/article/8dff14f2f68545b7a93c52405de75735
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https://doaj.org/article/8dff14f2f68545b7a93c52405de75735

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