Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing

Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of...

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Autores principales:	Paweł Kozłowski, Krzysztof Czuba, Krzysztof Chmielewski, Jacek Ratajczak, Joanna Branas, Adam Korczyc, Kazimierz Regiński, Agata Jasik
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	infrared photodetectors thermal evaporation metallization wet etching indium bumps annealing Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85
Acceso en línea:	https://doaj.org/article/8dff14f2f68545b7a93c52405de75735
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spelling	oai:doaj.org-article:8dff14f2f68545b7a93c52405de757352021-11-11T17:51:19ZIndium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing10.3390/ma142162691996-1944https://doaj.org/article/8dff14f2f68545b7a93c52405de757352021-10-01T00:00:00Zhttps://www.mdpi.com/1996-1944/14/21/6269https://doaj.org/toc/1996-1944Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of indium has been optimized to achieve ~8 μm-thick layers with a small surface roughness of R<sub>a</sub> = 11 nm, indicating a high packing density of atoms. This ensures bump uniformity across the sample, as well as prevents oxidation inside the In columns prior to the reflow. A series of experiments to optimize indium bump fabrication technology, including a shear test of single columns, is described. A reliable, repeatable, simple, and quick approach was developed with the pre-etching of indium columns in a 10% HCl solution preceded by annealing at 120 °C in N<sub>2</sub>.Paweł KozłowskiKrzysztof CzubaKrzysztof ChmielewskiJacek RatajczakJoanna BranasAdam KorczycKazimierz RegińskiAgata JasikMDPI AGarticleinfrared photodetectorsthermal evaporationmetallizationwet etchingindium bumpsannealingTechnologyTElectrical engineering. Electronics. Nuclear engineeringTK1-9971Engineering (General). Civil engineering (General)TA1-2040MicroscopyQH201-278.5Descriptive and experimental mechanicsQC120-168.85ENMaterials, Vol 14, Iss 6269, p 6269 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	infrared photodetectors thermal evaporation metallization wet etching indium bumps annealing Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85
spellingShingle	infrared photodetectors thermal evaporation metallization wet etching indium bumps annealing Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 Paweł Kozłowski Krzysztof Czuba Krzysztof Chmielewski Jacek Ratajczak Joanna Branas Adam Korczyc Kazimierz Regiński Agata Jasik Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing
description	Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of indium has been optimized to achieve ~8 μm-thick layers with a small surface roughness of R<sub>a</sub> = 11 nm, indicating a high packing density of atoms. This ensures bump uniformity across the sample, as well as prevents oxidation inside the In columns prior to the reflow. A series of experiments to optimize indium bump fabrication technology, including a shear test of single columns, is described. A reliable, repeatable, simple, and quick approach was developed with the pre-etching of indium columns in a 10% HCl solution preceded by annealing at 120 °C in N<sub>2</sub>.
format	article
author	Paweł Kozłowski Krzysztof Czuba Krzysztof Chmielewski Jacek Ratajczak Joanna Branas Adam Korczyc Kazimierz Regiński Agata Jasik
author_facet	Paweł Kozłowski Krzysztof Czuba Krzysztof Chmielewski Jacek Ratajczak Joanna Branas Adam Korczyc Kazimierz Regiński Agata Jasik
author_sort	Paweł Kozłowski
title	Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing
title_short	Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing
title_full	Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing
title_fullStr	Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing
title_full_unstemmed	Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing
title_sort	indium-based micro-bump array fabrication technology with added pre-reflow wet etching and annealing
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/8dff14f2f68545b7a93c52405de75735
work_keys_str_mv	AT pawełkozłowski indiumbasedmicrobumparrayfabricationtechnologywithaddedprereflowwetetchingandannealing AT krzysztofczuba indiumbasedmicrobumparrayfabricationtechnologywithaddedprereflowwetetchingandannealing AT krzysztofchmielewski indiumbasedmicrobumparrayfabricationtechnologywithaddedprereflowwetetchingandannealing AT jacekratajczak indiumbasedmicrobumparrayfabricationtechnologywithaddedprereflowwetetchingandannealing AT joannabranas indiumbasedmicrobumparrayfabricationtechnologywithaddedprereflowwetetchingandannealing AT adamkorczyc indiumbasedmicrobumparrayfabricationtechnologywithaddedprereflowwetetchingandannealing AT kazimierzreginski indiumbasedmicrobumparrayfabricationtechnologywithaddedprereflowwetetchingandannealing AT agatajasik indiumbasedmicrobumparrayfabricationtechnologywithaddedprereflowwetetchingandannealing
_version_	1718432012902072320

Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing

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