Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing

Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Paweł Kozłowski, Krzysztof Czuba, Krzysztof Chmielewski, Jacek Ratajczak, Joanna Branas, Adam Korczyc, Kazimierz Regiński, Agata Jasik
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
Materias:
T
Acceso en línea:https://doaj.org/article/8dff14f2f68545b7a93c52405de75735
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!

Ejemplares similares