Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure
Abstract The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of...
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| Autores principales: | , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
SpringerOpen
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/9087d371e2da42cc936d76a947b170d9 |
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