Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure
Abstract The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of...
Guardado en:
Autores principales: | , , |
---|---|
Formato: | article |
Lenguaje: | EN |
Publicado: |
SpringerOpen
2021
|
Materias: | |
Acceso en línea: | https://doaj.org/article/9087d371e2da42cc936d76a947b170d9 |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
id |
oai:doaj.org-article:9087d371e2da42cc936d76a947b170d9 |
---|---|
record_format |
dspace |
spelling |
oai:doaj.org-article:9087d371e2da42cc936d76a947b170d92021-11-28T12:03:35ZEffect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure10.1186/s10033-021-00640-w1000-93452192-8258https://doaj.org/article/9087d371e2da42cc936d76a947b170d92021-11-01T00:00:00Zhttps://doi.org/10.1186/s10033-021-00640-whttps://doaj.org/toc/1000-9345https://doaj.org/toc/2192-8258Abstract The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of different control factors, including high temperature, low temperature, dwell time of thermal cyclic loading, and different IMCs on the stress-strain response and fatigue life of solder joints were calculated respectively. The results indicate that maximum stress-strain can be found in the second solder joint on the diagonal of IMC solder joints array; for Sn-3.9Ag-0.6Cu solder joints array, the corner solder joints show the obvious maximum stress-strain, these areas are the crack propagated locations. The stress-strain and fatigue life of solder joints is more sensitive to dwell temperature, especially to high temperature; increasing the high temperature, dwell time, or decreasing the low temperature, can reduce the stress-strain and enlarge the fatigue life of solder joints. Finally, the optimal design in the 3D-IC structure has the combination of the Cu6Sn5/Cu3Sn, 373 K high temperature, 233 K low temperature, and 10 min dwell time. The fatigue lives of Sn-3.9Ag-0.6Cu under 218–398 K loading in the 3D assembly based on the creep strain are 347.4 cycles, which is in good agreement with experimental results (380 cycles).Liang ZhangWeimin LongSujuan ZhongSpringerOpenarticle3D-ICTaguchi methodControl factorsFatigue lifeOcean engineeringTC1501-1800Mechanical engineering and machineryTJ1-1570ENChinese Journal of Mechanical Engineering, Vol 34, Iss 1, Pp 1-9 (2021) |
institution |
DOAJ |
collection |
DOAJ |
language |
EN |
topic |
3D-IC Taguchi method Control factors Fatigue life Ocean engineering TC1501-1800 Mechanical engineering and machinery TJ1-1570 |
spellingShingle |
3D-IC Taguchi method Control factors Fatigue life Ocean engineering TC1501-1800 Mechanical engineering and machinery TJ1-1570 Liang Zhang Weimin Long Sujuan Zhong Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure |
description |
Abstract The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of different control factors, including high temperature, low temperature, dwell time of thermal cyclic loading, and different IMCs on the stress-strain response and fatigue life of solder joints were calculated respectively. The results indicate that maximum stress-strain can be found in the second solder joint on the diagonal of IMC solder joints array; for Sn-3.9Ag-0.6Cu solder joints array, the corner solder joints show the obvious maximum stress-strain, these areas are the crack propagated locations. The stress-strain and fatigue life of solder joints is more sensitive to dwell temperature, especially to high temperature; increasing the high temperature, dwell time, or decreasing the low temperature, can reduce the stress-strain and enlarge the fatigue life of solder joints. Finally, the optimal design in the 3D-IC structure has the combination of the Cu6Sn5/Cu3Sn, 373 K high temperature, 233 K low temperature, and 10 min dwell time. The fatigue lives of Sn-3.9Ag-0.6Cu under 218–398 K loading in the 3D assembly based on the creep strain are 347.4 cycles, which is in good agreement with experimental results (380 cycles). |
format |
article |
author |
Liang Zhang Weimin Long Sujuan Zhong |
author_facet |
Liang Zhang Weimin Long Sujuan Zhong |
author_sort |
Liang Zhang |
title |
Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure |
title_short |
Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure |
title_full |
Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure |
title_fullStr |
Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure |
title_full_unstemmed |
Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure |
title_sort |
effect of thermal cyclic loading on stress-strain response and fatigue life of 3d chip stacking structure |
publisher |
SpringerOpen |
publishDate |
2021 |
url |
https://doaj.org/article/9087d371e2da42cc936d76a947b170d9 |
work_keys_str_mv |
AT liangzhang effectofthermalcyclicloadingonstressstrainresponseandfatiguelifeof3dchipstackingstructure AT weiminlong effectofthermalcyclicloadingonstressstrainresponseandfatiguelifeof3dchipstackingstructure AT sujuanzhong effectofthermalcyclicloadingonstressstrainresponseandfatiguelifeof3dchipstackingstructure |
_version_ |
1718408212743454720 |