Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Abstract The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of...

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Autores principales: Liang Zhang, Weimin Long, Sujuan Zhong
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Publicado: SpringerOpen 2021
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Acceso en línea:https://doaj.org/article/9087d371e2da42cc936d76a947b170d9
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spelling oai:doaj.org-article:9087d371e2da42cc936d76a947b170d92021-11-28T12:03:35ZEffect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure10.1186/s10033-021-00640-w1000-93452192-8258https://doaj.org/article/9087d371e2da42cc936d76a947b170d92021-11-01T00:00:00Zhttps://doi.org/10.1186/s10033-021-00640-whttps://doaj.org/toc/1000-9345https://doaj.org/toc/2192-8258Abstract The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of different control factors, including high temperature, low temperature, dwell time of thermal cyclic loading, and different IMCs on the stress-strain response and fatigue life of solder joints were calculated respectively. The results indicate that maximum stress-strain can be found in the second solder joint on the diagonal of IMC solder joints array; for Sn-3.9Ag-0.6Cu solder joints array, the corner solder joints show the obvious maximum stress-strain, these areas are the crack propagated locations. The stress-strain and fatigue life of solder joints is more sensitive to dwell temperature, especially to high temperature; increasing the high temperature, dwell time, or decreasing the low temperature, can reduce the stress-strain and enlarge the fatigue life of solder joints. Finally, the optimal design in the 3D-IC structure has the combination of the Cu6Sn5/Cu3Sn, 373 K high temperature, 233 K low temperature, and 10 min dwell time. The fatigue lives of Sn-3.9Ag-0.6Cu under 218–398 K loading in the 3D assembly based on the creep strain are 347.4 cycles, which is in good agreement with experimental results (380 cycles).Liang ZhangWeimin LongSujuan ZhongSpringerOpenarticle3D-ICTaguchi methodControl factorsFatigue lifeOcean engineeringTC1501-1800Mechanical engineering and machineryTJ1-1570ENChinese Journal of Mechanical Engineering, Vol 34, Iss 1, Pp 1-9 (2021)
institution DOAJ
collection DOAJ
language EN
topic 3D-IC
Taguchi method
Control factors
Fatigue life
Ocean engineering
TC1501-1800
Mechanical engineering and machinery
TJ1-1570
spellingShingle 3D-IC
Taguchi method
Control factors
Fatigue life
Ocean engineering
TC1501-1800
Mechanical engineering and machinery
TJ1-1570
Liang Zhang
Weimin Long
Sujuan Zhong
Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure
description Abstract The thermo-mechanical reliability of IMCs (Ni3Sn4, Cu3Sn, Cu6Sn5) solder joints and Sn-3.9Ag-0.6Cu solder joints was investigated systematically in 3D chip stacking structure subjected to an accelerated thermal cyclic loading based on finite element simulation and Taguchi method. Effects of different control factors, including high temperature, low temperature, dwell time of thermal cyclic loading, and different IMCs on the stress-strain response and fatigue life of solder joints were calculated respectively. The results indicate that maximum stress-strain can be found in the second solder joint on the diagonal of IMC solder joints array; for Sn-3.9Ag-0.6Cu solder joints array, the corner solder joints show the obvious maximum stress-strain, these areas are the crack propagated locations. The stress-strain and fatigue life of solder joints is more sensitive to dwell temperature, especially to high temperature; increasing the high temperature, dwell time, or decreasing the low temperature, can reduce the stress-strain and enlarge the fatigue life of solder joints. Finally, the optimal design in the 3D-IC structure has the combination of the Cu6Sn5/Cu3Sn, 373 K high temperature, 233 K low temperature, and 10 min dwell time. The fatigue lives of Sn-3.9Ag-0.6Cu under 218–398 K loading in the 3D assembly based on the creep strain are 347.4 cycles, which is in good agreement with experimental results (380 cycles).
format article
author Liang Zhang
Weimin Long
Sujuan Zhong
author_facet Liang Zhang
Weimin Long
Sujuan Zhong
author_sort Liang Zhang
title Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure
title_short Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure
title_full Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure
title_fullStr Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure
title_full_unstemmed Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure
title_sort effect of thermal cyclic loading on stress-strain response and fatigue life of 3d chip stacking structure
publisher SpringerOpen
publishDate 2021
url https://doaj.org/article/9087d371e2da42cc936d76a947b170d9
work_keys_str_mv AT liangzhang effectofthermalcyclicloadingonstressstrainresponseandfatiguelifeof3dchipstackingstructure
AT weiminlong effectofthermalcyclicloadingonstressstrainresponseandfatiguelifeof3dchipstackingstructure
AT sujuanzhong effectofthermalcyclicloadingonstressstrainresponseandfatiguelifeof3dchipstackingstructure
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