Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding
Abstract An anti-oxidant Cu layer was achieved by remote mode N2 plasma. Remote mode plasma treatment offers the advantages of having no defect formation, such as pinholes, by energetic ions. In this study, an activated Cu surface by Ar plasma chemically reacted with N free radicals to evenly form C...
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| Autores principales: | , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Nature Portfolio
2020
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/90c48bcacad245888cf328699115ed40 |
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