A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
Abstract Microbumps in three-dimensional integrated circuit now becomes essential technology to reach higher packaging density. However, the small volume of microbumps dramatically changes the characteristics from the flip-chip (FC) solder joints. For a 20 µm diameter microbump, the cross-section ar...
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| Autores principales: | , , , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Nature Portfolio
2018
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/95d9bab85d2d47cb8eb43dd4186fb7ff |
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