Washable, Low-Temperature Cured Joints for Textile-Based Electronics

Low-temperature die-attaching pastes for wearable electronics are the key components to realize any type of device where components are additively manufactured by pick and place techniques. In this paper, the authors describe a simple method to realize stretchable, bendable, die-attaching pastes bas...

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Autores principales: Jerzy Szalapak, Vitalij Scenev, Daniel Janczak, Lukas Werft, Sigrid Rotzler, Malgorzata Jakubowska, Malte von Krshiwoblozki, Christine Kallmayer, Martin Schneider-Ramelow
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/9fbccfb09e9b4efa885de9572eb65594
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