Washable, Low-Temperature Cured Joints for Textile-Based Electronics

Low-temperature die-attaching pastes for wearable electronics are the key components to realize any type of device where components are additively manufactured by pick and place techniques. In this paper, the authors describe a simple method to realize stretchable, bendable, die-attaching pastes bas...

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Autores principales:	Jerzy Szalapak, Vitalij Scenev, Daniel Janczak, Lukas Werft, Sigrid Rotzler, Malgorzata Jakubowska, Malte von Krshiwoblozki, Christine Kallmayer, Martin Schneider-Ramelow
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	conductive adhesive silver flakes screen-printing low temperature printed electronics Electronics TK7800-8360
Acceso en línea:	https://doaj.org/article/9fbccfb09e9b4efa885de9572eb65594
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id	oai:doaj.org-article:9fbccfb09e9b4efa885de9572eb65594
record_format	dspace
spelling	oai:doaj.org-article:9fbccfb09e9b4efa885de9572eb655942021-11-25T17:24:19ZWashable, Low-Temperature Cured Joints for Textile-Based Electronics10.3390/electronics102227492079-9292https://doaj.org/article/9fbccfb09e9b4efa885de9572eb655942021-11-01T00:00:00Zhttps://www.mdpi.com/2079-9292/10/22/2749https://doaj.org/toc/2079-9292Low-temperature die-attaching pastes for wearable electronics are the key components to realize any type of device where components are additively manufactured by pick and place techniques. In this paper, the authors describe a simple method to realize stretchable, bendable, die-attaching pastes based on silver flakes to directly mount resistors and LEDs onto textiles. This paste can be directly applied onto contact pads placed on textiles by means of screen and stencil printing and post-processed at low temperatures to achieve the desired electrical and mechanical properties below 60 °C without sintering. Low curing temperatures lead to lower power consumption, which makes this paste ecological friendly.Jerzy SzalapakVitalij ScenevDaniel JanczakLukas WerftSigrid RotzlerMalgorzata JakubowskaMalte von KrshiwoblozkiChristine KallmayerMartin Schneider-RamelowMDPI AGarticleconductive adhesivesilver flakesscreen-printinglow temperatureprinted electronicsElectronicsTK7800-8360ENElectronics, Vol 10, Iss 2749, p 2749 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	conductive adhesive silver flakes screen-printing low temperature printed electronics Electronics TK7800-8360
spellingShingle	conductive adhesive silver flakes screen-printing low temperature printed electronics Electronics TK7800-8360 Jerzy Szalapak Vitalij Scenev Daniel Janczak Lukas Werft Sigrid Rotzler Malgorzata Jakubowska Malte von Krshiwoblozki Christine Kallmayer Martin Schneider-Ramelow Washable, Low-Temperature Cured Joints for Textile-Based Electronics
description	Low-temperature die-attaching pastes for wearable electronics are the key components to realize any type of device where components are additively manufactured by pick and place techniques. In this paper, the authors describe a simple method to realize stretchable, bendable, die-attaching pastes based on silver flakes to directly mount resistors and LEDs onto textiles. This paste can be directly applied onto contact pads placed on textiles by means of screen and stencil printing and post-processed at low temperatures to achieve the desired electrical and mechanical properties below 60 °C without sintering. Low curing temperatures lead to lower power consumption, which makes this paste ecological friendly.
format	article
author	Jerzy Szalapak Vitalij Scenev Daniel Janczak Lukas Werft Sigrid Rotzler Malgorzata Jakubowska Malte von Krshiwoblozki Christine Kallmayer Martin Schneider-Ramelow
author_facet	Jerzy Szalapak Vitalij Scenev Daniel Janczak Lukas Werft Sigrid Rotzler Malgorzata Jakubowska Malte von Krshiwoblozki Christine Kallmayer Martin Schneider-Ramelow
author_sort	Jerzy Szalapak
title	Washable, Low-Temperature Cured Joints for Textile-Based Electronics
title_short	Washable, Low-Temperature Cured Joints for Textile-Based Electronics
title_full	Washable, Low-Temperature Cured Joints for Textile-Based Electronics
title_fullStr	Washable, Low-Temperature Cured Joints for Textile-Based Electronics
title_full_unstemmed	Washable, Low-Temperature Cured Joints for Textile-Based Electronics
title_sort	washable, low-temperature cured joints for textile-based electronics
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/9fbccfb09e9b4efa885de9572eb65594
work_keys_str_mv	AT jerzyszalapak washablelowtemperaturecuredjointsfortextilebasedelectronics AT vitalijscenev washablelowtemperaturecuredjointsfortextilebasedelectronics AT danieljanczak washablelowtemperaturecuredjointsfortextilebasedelectronics AT lukaswerft washablelowtemperaturecuredjointsfortextilebasedelectronics AT sigridrotzler washablelowtemperaturecuredjointsfortextilebasedelectronics AT malgorzatajakubowska washablelowtemperaturecuredjointsfortextilebasedelectronics AT maltevonkrshiwoblozki washablelowtemperaturecuredjointsfortextilebasedelectronics AT christinekallmayer washablelowtemperaturecuredjointsfortextilebasedelectronics AT martinschneiderramelow washablelowtemperaturecuredjointsfortextilebasedelectronics
_version_	1718412424446476288

Washable, Low-Temperature Cured Joints for Textile-Based Electronics

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