Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization

The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution...

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Auteurs principaux: Oleg S. Medvedev, Ekaterina E. Alyasova, Rona E. Besprozvannaya, Asadula A. Gadzhiev, Veronika V. Krivova, Andrey S. Kondratev, Artem E. Kim, Pavel A. Novikov, Anatoliy A. Popovich
Format: article
Langue:EN
Publié: MDPI AG 2021
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Accès en ligne:https://doaj.org/article/a2ea513d54d24821aa1af9fafaf434e1
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