Ge FinFET CMOS Inverters With Improved Channel Surface Roughness by Using <italic>In-Situ</italic> ALD Digital O<sub>3</sub> Treatment

Improved electrical characteristics of CMOS inverters composed of Ge n- and p-finFETs were demonstrated by utilizing newly introduced Ge surface treatments. <italic>In-situ</italic> digital O<sub>3</sub> treatment in ALD chamber was adopted on the surface of Ge fin sidewall i...

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Autores principales: M.-S. Yeh, G.-L. Luo, F.-J. Hou, P.-J. Sung, C. J. Wang, C.-J. Su, C.-T. WU, Y.-C. Huang, T.-C. Hong, B.-Y. Chen, K.-M. Chen, Y.-C. WU, M. Izawa, M. Miura, M. Morimoto, H. Ishimura, Y.-J. Lee, W.-F. Wu, W.-K. Yeh
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Publicado: IEEE 2018
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spelling oai:doaj.org-article:a5f5f525abe24ceda9f3e6d0178335bc2021-11-19T00:00:49ZGe FinFET CMOS Inverters With Improved Channel Surface Roughness by Using <italic>In-Situ</italic> ALD Digital O<sub>3</sub> Treatment2168-673410.1109/JEDS.2018.2878929https://doaj.org/article/a5f5f525abe24ceda9f3e6d0178335bc2018-01-01T00:00:00Zhttps://ieeexplore.ieee.org/document/8519615/https://doaj.org/toc/2168-6734Improved electrical characteristics of CMOS inverters composed of Ge n- and p-finFETs were demonstrated by utilizing newly introduced Ge surface treatments. <italic>In-situ</italic> digital O<sub>3</sub> treatment in ALD chamber was adopted on the surface of Ge fin sidewall in order to reduce the roughness and etching damages through the GeO desorption mechanism. The treatment effects were checked by AFM and C-V measurements. By combining this treatment with optimized microwave annealing, sub-threshold slope and the <inline-formula> <tex-math notation="LaTeX">$\text{I}_{\mathrm{ ON}}/\text{I}_{\mathrm{ OFF}}$ </tex-math></inline-formula> ratio were remarkably improved in both n-finFET and p-finFET, and Ge CMOS inverters with high voltage gain of 50.3 V/V at low <inline-formula> <tex-math notation="LaTeX">${V}_{D}= 0.6$ </tex-math></inline-formula> V was realized. Finally, simulations on an ideal Ge CMOS inverter were presented.M.-S. YehG.-L. LuoF.-J. HouP.-J. SungC. J. WangC.-J. SuC.-T. WUY.-C. HuangT.-C. HongB.-Y. ChenK.-M. ChenY.-C. WUM. IzawaM. MiuraM. MorimotoH. IshimuraY.-J. LeeW.-F. WuW.-K. YehIEEEarticleALD high-k<italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">in-situ</italic> digital ozone treatment (IDOT)CMOSFinFETgermaniuminvertersElectrical engineering. Electronics. Nuclear engineeringTK1-9971ENIEEE Journal of the Electron Devices Society, Vol 6, Pp 1227-1232 (2018)
institution DOAJ
collection DOAJ
language EN
topic ALD high-k
<italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">in-situ</italic> digital ozone treatment (IDOT)
CMOS
FinFET
germanium
inverters
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
spellingShingle ALD high-k
<italic xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">in-situ</italic> digital ozone treatment (IDOT)
CMOS
FinFET
germanium
inverters
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
M.-S. Yeh
G.-L. Luo
F.-J. Hou
P.-J. Sung
C. J. Wang
C.-J. Su
C.-T. WU
Y.-C. Huang
T.-C. Hong
B.-Y. Chen
K.-M. Chen
Y.-C. WU
M. Izawa
M. Miura
M. Morimoto
H. Ishimura
Y.-J. Lee
W.-F. Wu
W.-K. Yeh
Ge FinFET CMOS Inverters With Improved Channel Surface Roughness by Using <italic>In-Situ</italic> ALD Digital O<sub>3</sub> Treatment
description Improved electrical characteristics of CMOS inverters composed of Ge n- and p-finFETs were demonstrated by utilizing newly introduced Ge surface treatments. <italic>In-situ</italic> digital O<sub>3</sub> treatment in ALD chamber was adopted on the surface of Ge fin sidewall in order to reduce the roughness and etching damages through the GeO desorption mechanism. The treatment effects were checked by AFM and C-V measurements. By combining this treatment with optimized microwave annealing, sub-threshold slope and the <inline-formula> <tex-math notation="LaTeX">$\text{I}_{\mathrm{ ON}}/\text{I}_{\mathrm{ OFF}}$ </tex-math></inline-formula> ratio were remarkably improved in both n-finFET and p-finFET, and Ge CMOS inverters with high voltage gain of 50.3 V/V at low <inline-formula> <tex-math notation="LaTeX">${V}_{D}= 0.6$ </tex-math></inline-formula> V was realized. Finally, simulations on an ideal Ge CMOS inverter were presented.
format article
author M.-S. Yeh
G.-L. Luo
F.-J. Hou
P.-J. Sung
C. J. Wang
C.-J. Su
C.-T. WU
Y.-C. Huang
T.-C. Hong
B.-Y. Chen
K.-M. Chen
Y.-C. WU
M. Izawa
M. Miura
M. Morimoto
H. Ishimura
Y.-J. Lee
W.-F. Wu
W.-K. Yeh
author_facet M.-S. Yeh
G.-L. Luo
F.-J. Hou
P.-J. Sung
C. J. Wang
C.-J. Su
C.-T. WU
Y.-C. Huang
T.-C. Hong
B.-Y. Chen
K.-M. Chen
Y.-C. WU
M. Izawa
M. Miura
M. Morimoto
H. Ishimura
Y.-J. Lee
W.-F. Wu
W.-K. Yeh
author_sort M.-S. Yeh
title Ge FinFET CMOS Inverters With Improved Channel Surface Roughness by Using <italic>In-Situ</italic> ALD Digital O<sub>3</sub> Treatment
title_short Ge FinFET CMOS Inverters With Improved Channel Surface Roughness by Using <italic>In-Situ</italic> ALD Digital O<sub>3</sub> Treatment
title_full Ge FinFET CMOS Inverters With Improved Channel Surface Roughness by Using <italic>In-Situ</italic> ALD Digital O<sub>3</sub> Treatment
title_fullStr Ge FinFET CMOS Inverters With Improved Channel Surface Roughness by Using <italic>In-Situ</italic> ALD Digital O<sub>3</sub> Treatment
title_full_unstemmed Ge FinFET CMOS Inverters With Improved Channel Surface Roughness by Using <italic>In-Situ</italic> ALD Digital O<sub>3</sub> Treatment
title_sort ge finfet cmos inverters with improved channel surface roughness by using <italic>in-situ</italic> ald digital o<sub>3</sub> treatment
publisher IEEE
publishDate 2018
url https://doaj.org/article/a5f5f525abe24ceda9f3e6d0178335bc
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