An RF Stress-Based Thermal Shock Test Method for a CMOS Power Amplifier

To accelerate the degradation of critical specifications of CMOS power amplifiers (PAs), this paper proposes a new measurement method that introduces radio frequency (RF) stress in the thermal shock test of CMOS PAs. The experimental results show that the proposed method is effective. The degradatio...

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Auteurs principaux: Shaohua Zhou, Jian Wang
Format: article
Langue:EN
Publié: IEEE 2021
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Accès en ligne:https://doaj.org/article/a7ebdc6777c8436186d11fd39a495fba
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