Antimicrobial Activity of a Novel Cu(NO<sub>3</sub>)<sub>2</sub>-Containing Sol–Gel Surface under Different Testing Conditions

Antimicrobial Activity of a Novel Cu(NO<sub>3</sub>)<sub>2</sub>-Containing Sol–Gel Surface under Different Testing Conditions

In this study, assessment of the antimicrobial activity of a novel, plasma-cured 2.5% (<i>w</i>/<i>v</i>) Cu(NO<sub>3</sub>)<sub>2</sub>-containing sol–gel surface was performed. In contrast to state-of-the-art sol–gel coatings, the plasma curing led t...

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Détails bibliographiques
Auteurs principaux: Daniela Toplitsch, Jürgen Markus Lackner, Alexander Michael Schwan, Andreas Hinterer, Philipp Stögmüller, Kerstin Horn, Natalie Fritzlar, Andreas Pfuch, Clemens Kittinger
Format: article
Langue:EN
Publié: MDPI AG 2021
Sujets:
copper
sol–gel surface coating
antibacterial surface
ISO 22196
Technology
T
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Engineering (General). Civil engineering (General)
TA1-2040
Microscopy
QH201-278.5
Descriptive and experimental mechanics
QC120-168.85
Accès en ligne:https://doaj.org/article/b18c6b09dedd430eb00471056b801de4
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https://doaj.org/article/b18c6b09dedd430eb00471056b801de4

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