Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
Though large-scale integration of organic transistors into integrated circuits via 3D stacking is a promising approach, reliable methods of device fabrication are still needed. Here, the authors report a metal interconnect scheme for reliable fabrication of 3D integrated organic transistor circuits.
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| Autores principales: | , , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Nature Portfolio
2019
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/b290b85f242a427e9347b3b9aa9fbd52 |
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| Sumario: | Though large-scale integration of organic transistors into integrated circuits via 3D stacking is a promising approach, reliable methods of device fabrication are still needed. Here, the authors report a metal interconnect scheme for reliable fabrication of 3D integrated organic transistor circuits. |
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