Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects

Though large-scale integration of organic transistors into integrated circuits via 3D stacking is a promising approach, reliable methods of device fabrication are still needed. Here, the authors report a metal interconnect scheme for reliable fabrication of 3D integrated organic transistor circuits.

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Autores principales:	Hocheon Yoo, Hongkeun Park, Seunghyun Yoo, Sungmin On, Hyejeong Seong, Sung Gap Im, Jae-Joon Kim
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2019
Materias:	Science Q
Acceso en línea:	https://doaj.org/article/b290b85f242a427e9347b3b9aa9fbd52
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spelling	oai:doaj.org-article:b290b85f242a427e9347b3b9aa9fbd522021-12-02T17:32:24ZHighly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects10.1038/s41467-019-10412-92041-1723https://doaj.org/article/b290b85f242a427e9347b3b9aa9fbd522019-06-01T00:00:00Zhttps://doi.org/10.1038/s41467-019-10412-9https://doaj.org/toc/2041-1723Though large-scale integration of organic transistors into integrated circuits via 3D stacking is a promising approach, reliable methods of device fabrication are still needed. Here, the authors report a metal interconnect scheme for reliable fabrication of 3D integrated organic transistor circuits.Hocheon YooHongkeun ParkSeunghyun YooSungmin OnHyejeong SeongSung Gap ImJae-Joon KimNature PortfolioarticleScienceQENNature Communications, Vol 10, Iss 1, Pp 1-9 (2019)
institution	DOAJ
collection	DOAJ
language	EN
topic	Science Q
spellingShingle	Science Q Hocheon Yoo Hongkeun Park Seunghyun Yoo Sungmin On Hyejeong Seong Sung Gap Im Jae-Joon Kim Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
description	Though large-scale integration of organic transistors into integrated circuits via 3D stacking is a promising approach, reliable methods of device fabrication are still needed. Here, the authors report a metal interconnect scheme for reliable fabrication of 3D integrated organic transistor circuits.
format	article
author	Hocheon Yoo Hongkeun Park Seunghyun Yoo Sungmin On Hyejeong Seong Sung Gap Im Jae-Joon Kim
author_facet	Hocheon Yoo Hongkeun Park Seunghyun Yoo Sungmin On Hyejeong Seong Sung Gap Im Jae-Joon Kim
author_sort	Hocheon Yoo
title	Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
title_short	Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
title_full	Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
title_fullStr	Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
title_full_unstemmed	Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
title_sort	highly stacked 3d organic integrated circuits with via-hole-less multilevel metal interconnects
publisher	Nature Portfolio
publishDate	2019
url	https://doaj.org/article/b290b85f242a427e9347b3b9aa9fbd52
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Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects

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