Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide

Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide

The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/poly...

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Bibliographic Details
Main Authors: Juncheng Xia, Yue Qin, Xianzhe Wei, Linhong Li, Maohua Li, Xiangdong Kong, Shaoyang Xiong, Tao Cai, Wen Dai, Cheng-Te Lin, Nan Jiang, Shuangquan Fang, Jian Yi, Jinhong Yu
Format: article
Language:EN
Published: MDPI AG 2021
Subjects:
silicon carbide
polyvinylidene fluoride
thermal conductivity
electronic packaging
Chemistry
QD1-999
Online Access:https://doaj.org/article/b8c15bbe68204aecb1ea94f8508facf2
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https://doaj.org/article/b8c15bbe68204aecb1ea94f8508facf2

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