Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide
The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/poly...
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| Auteurs principaux: | , , , , , , , , , , , , , |
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| Format: | article |
| Langue: | EN |
| Publié: |
MDPI AG
2021
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| Sujets: | |
| Accès en ligne: | https://doaj.org/article/b8c15bbe68204aecb1ea94f8508facf2 |
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