The settling behavior of matte particles in copper slag and the new technology of copper slag cleaning

Settling time, system temperature and reductant amount play an important role in the recovery of matte from copper slag. This study investigated the settling behavior of matte particles in copper slag and the effects of the settling time, system temperature, and reductant amount on the macrostructur...

Description complète

Enregistré dans:
Détails bibliographiques
Auteurs principaux: Haipei Zhang, Bo Li, Yonggang Wei, Hua Wang
Format: article
Langue:EN
Publié: Elsevier 2021
Sujets:
Accès en ligne:https://doaj.org/article/bd58ecf045594a8fb22d0105a040e306
Tags: Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!