Cita APA (7a ed.)

Zhang, H., Li, B., Wei, Y., & Wang, H. (2021). The settling behavior of matte particles in copper slag and the new technology of copper slag cleaning. Elsevier.

Cita Chicago Style (17a ed.)

Zhang, Haipei, Bo Li, Yonggang Wei, y Hua Wang. The Settling Behavior of Matte Particles in Copper Slag and the New Technology of Copper Slag Cleaning. Elsevier, 2021.

Cita MLA (8a ed.)

Zhang, Haipei, et al. The Settling Behavior of Matte Particles in Copper Slag and the New Technology of Copper Slag Cleaning. Elsevier, 2021.