The settling behavior of matte particles in copper slag and the new technology of copper slag cleaning
Settling time, system temperature and reductant amount play an important role in the recovery of matte from copper slag. This study investigated the settling behavior of matte particles in copper slag and the effects of the settling time, system temperature, and reductant amount on the macrostructur...
Guardado en:
Autores principales: | , , , |
---|---|
Formato: | article |
Lenguaje: | EN |
Publicado: |
Elsevier
2021
|
Materias: | |
Acceso en línea: | https://doaj.org/article/bd58ecf045594a8fb22d0105a040e306 |
Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
id |
oai:doaj.org-article:bd58ecf045594a8fb22d0105a040e306 |
---|---|
record_format |
dspace |
spelling |
oai:doaj.org-article:bd58ecf045594a8fb22d0105a040e3062021-11-30T04:16:17ZThe settling behavior of matte particles in copper slag and the new technology of copper slag cleaning2238-785410.1016/j.jmrt.2021.11.061https://doaj.org/article/bd58ecf045594a8fb22d0105a040e3062021-11-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S2238785421013405https://doaj.org/toc/2238-7854Settling time, system temperature and reductant amount play an important role in the recovery of matte from copper slag. This study investigated the settling behavior of matte particles in copper slag and the effects of the settling time, system temperature, and reductant amount on the macrostructure of slag, microstructure of matte particles, and copper loss. The results showed that the settling behavior of matte particles in slag at the experimental temperature was a process of aggregation and growth. With an increase in settling time and temperature, as well as the addition of an appropriate amount of anthracite, the foaming slag layer of the slowly cooled slag gradually disappeared, while the recovery of matte increased. However, when the amount of anthracite was too high, Fe–Cu alloy formed at the experimental temperature, which resulted in worsened fluidity of the matte in the molten slag and copper loss increased. At the experimental temperature, the settling environment of matte particles in the liquid phase layer was superior to that of the foaming slag layer. The novel idea of using rubber seed oil instead of a traditional fossil reductant to clean the copper slag was put forward. At the temperature of 1250 °C, 4 mL of rubber seed oil was injected, resulting in a settling time of ≥90 min, after which the copper content in the upper part of the slowly cooled slag was less than 0.57 wt.%, reaching the acceptable level of discardable slag in industry.Haipei ZhangBo LiYonggang WeiHua WangElsevierarticleCopper slag cleaningSettling separationMatteFe3O4Mining engineering. MetallurgyTN1-997ENJournal of Materials Research and Technology, Vol 15, Iss , Pp 6216-6230 (2021) |
institution |
DOAJ |
collection |
DOAJ |
language |
EN |
topic |
Copper slag cleaning Settling separation Matte Fe3O4 Mining engineering. Metallurgy TN1-997 |
spellingShingle |
Copper slag cleaning Settling separation Matte Fe3O4 Mining engineering. Metallurgy TN1-997 Haipei Zhang Bo Li Yonggang Wei Hua Wang The settling behavior of matte particles in copper slag and the new technology of copper slag cleaning |
description |
Settling time, system temperature and reductant amount play an important role in the recovery of matte from copper slag. This study investigated the settling behavior of matte particles in copper slag and the effects of the settling time, system temperature, and reductant amount on the macrostructure of slag, microstructure of matte particles, and copper loss. The results showed that the settling behavior of matte particles in slag at the experimental temperature was a process of aggregation and growth. With an increase in settling time and temperature, as well as the addition of an appropriate amount of anthracite, the foaming slag layer of the slowly cooled slag gradually disappeared, while the recovery of matte increased. However, when the amount of anthracite was too high, Fe–Cu alloy formed at the experimental temperature, which resulted in worsened fluidity of the matte in the molten slag and copper loss increased. At the experimental temperature, the settling environment of matte particles in the liquid phase layer was superior to that of the foaming slag layer. The novel idea of using rubber seed oil instead of a traditional fossil reductant to clean the copper slag was put forward. At the temperature of 1250 °C, 4 mL of rubber seed oil was injected, resulting in a settling time of ≥90 min, after which the copper content in the upper part of the slowly cooled slag was less than 0.57 wt.%, reaching the acceptable level of discardable slag in industry. |
format |
article |
author |
Haipei Zhang Bo Li Yonggang Wei Hua Wang |
author_facet |
Haipei Zhang Bo Li Yonggang Wei Hua Wang |
author_sort |
Haipei Zhang |
title |
The settling behavior of matte particles in copper slag and the new technology of copper slag cleaning |
title_short |
The settling behavior of matte particles in copper slag and the new technology of copper slag cleaning |
title_full |
The settling behavior of matte particles in copper slag and the new technology of copper slag cleaning |
title_fullStr |
The settling behavior of matte particles in copper slag and the new technology of copper slag cleaning |
title_full_unstemmed |
The settling behavior of matte particles in copper slag and the new technology of copper slag cleaning |
title_sort |
settling behavior of matte particles in copper slag and the new technology of copper slag cleaning |
publisher |
Elsevier |
publishDate |
2021 |
url |
https://doaj.org/article/bd58ecf045594a8fb22d0105a040e306 |
work_keys_str_mv |
AT haipeizhang thesettlingbehaviorofmatteparticlesincopperslagandthenewtechnologyofcopperslagcleaning AT boli thesettlingbehaviorofmatteparticlesincopperslagandthenewtechnologyofcopperslagcleaning AT yonggangwei thesettlingbehaviorofmatteparticlesincopperslagandthenewtechnologyofcopperslagcleaning AT huawang thesettlingbehaviorofmatteparticlesincopperslagandthenewtechnologyofcopperslagcleaning AT haipeizhang settlingbehaviorofmatteparticlesincopperslagandthenewtechnologyofcopperslagcleaning AT boli settlingbehaviorofmatteparticlesincopperslagandthenewtechnologyofcopperslagcleaning AT yonggangwei settlingbehaviorofmatteparticlesincopperslagandthenewtechnologyofcopperslagcleaning AT huawang settlingbehaviorofmatteparticlesincopperslagandthenewtechnologyofcopperslagcleaning |
_version_ |
1718406828851724288 |