Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
The field of molecular electronics is currently held back by the lack of scalability and reproducibility of existing break junction technologies. Here, Dubois et al. demonstrate parallel fabrication of millions of gold break junctions with sub-3 nm gaps via controllable crack formation on a wafer sc...
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| Autores principales: | , , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Nature Portfolio
2018
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/c6455ba1125045c28f4b2ec94ec92297 |
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| Sumario: | The field of molecular electronics is currently held back by the lack of scalability and reproducibility of existing break junction technologies. Here, Dubois et al. demonstrate parallel fabrication of millions of gold break junctions with sub-3 nm gaps via controllable crack formation on a wafer scale. |
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