Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

The field of molecular electronics is currently held back by the lack of scalability and reproducibility of existing break junction technologies. Here, Dubois et al. demonstrate parallel fabrication of millions of gold break junctions with sub-3 nm gaps via controllable crack formation on a wafer sc...

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Autores principales:	Valentin Dubois, Shyamprasad N. Raja, Pascal Gehring, Sabina Caneva, Herre S. J. van der Zant, Frank Niklaus, Göran Stemme
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2018
Materias:	Science Q
Acceso en línea:	https://doaj.org/article/c6455ba1125045c28f4b2ec94ec92297
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spelling	oai:doaj.org-article:c6455ba1125045c28f4b2ec94ec922972021-12-02T14:39:07ZMassively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices10.1038/s41467-018-05785-22041-1723https://doaj.org/article/c6455ba1125045c28f4b2ec94ec922972018-08-01T00:00:00Zhttps://doi.org/10.1038/s41467-018-05785-2https://doaj.org/toc/2041-1723The field of molecular electronics is currently held back by the lack of scalability and reproducibility of existing break junction technologies. Here, Dubois et al. demonstrate parallel fabrication of millions of gold break junctions with sub-3 nm gaps via controllable crack formation on a wafer scale.Valentin DuboisShyamprasad N. RajaPascal GehringSabina CanevaHerre S. J. van der ZantFrank NiklausGöran StemmeNature PortfolioarticleScienceQENNature Communications, Vol 9, Iss 1, Pp 1-10 (2018)
institution	DOAJ
collection	DOAJ
language	EN
topic	Science Q
spellingShingle	Science Q Valentin Dubois Shyamprasad N. Raja Pascal Gehring Sabina Caneva Herre S. J. van der Zant Frank Niklaus Göran Stemme Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
description	The field of molecular electronics is currently held back by the lack of scalability and reproducibility of existing break junction technologies. Here, Dubois et al. demonstrate parallel fabrication of millions of gold break junctions with sub-3 nm gaps via controllable crack formation on a wafer scale.
format	article
author	Valentin Dubois Shyamprasad N. Raja Pascal Gehring Sabina Caneva Herre S. J. van der Zant Frank Niklaus Göran Stemme
author_facet	Valentin Dubois Shyamprasad N. Raja Pascal Gehring Sabina Caneva Herre S. J. van der Zant Frank Niklaus Göran Stemme
author_sort	Valentin Dubois
title	Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
title_short	Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
title_full	Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
title_fullStr	Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
title_full_unstemmed	Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
title_sort	massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices
publisher	Nature Portfolio
publishDate	2018
url	https://doaj.org/article/c6455ba1125045c28f4b2ec94ec92297
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Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

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