Loss in discharging atoms through artificial hole for fabricating metallic micro/nanowire by electromigration
The electromigration (EM) technique is a method that is used to ensure the physical growth of metallic micro/nanowires. In the EM technique, the atomic diffusion of metals is intentionally accelerated by controlling the input current and heating the substrate, thus forming a hillock owing to the acc...
Saved in:
Main Author: | Yasuhiro KIMURA |
---|---|
Format: | article |
Language: | EN |
Published: |
The Japan Society of Mechanical Engineers
2019
|
Subjects: | |
Online Access: | https://doaj.org/article/cac580521cad475d80f84640fa39acb0 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide
by: I-Hsin Tseng, et al.
Published: (2021) -
Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps
by: Kai-Cheng Shie, et al.
Published: (2021) -
Bottom-Up Fabrication of Protein Nanowires via Controlled Self-Assembly of Recombinant <italic toggle="yes">Geobacter</italic> Pilins
by: K. M. Cosert, et al.
Published: (2019) -
Lamellar macular hole surgery – current concepts, future prospects
by: Haritoglou C, et al.
Published: (2019) -
Fluorescent Biosensors Based on Silicon Nanowires
by: Antonio Alessio Leonardi, et al.
Published: (2021)