Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces
The wetting and adhesion properties of undulated a-C:H surfaces were investigated. The nano-undulated a-C:H films were prepared by radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD) using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM and AFM analysis showed that the s...
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| Autores principales: | , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
Japanese Society of Tribologists
2008
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/d194fbd24a5d4260ad749601404374b2 |
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