Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces

The wetting and adhesion properties of undulated a-C:H surfaces were investigated. The nano-undulated a-C:H films were prepared by radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD) using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM and AFM analysis showed that the s...

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Autores principales:	Young-Jun Jang, Norisugu Umehara
Formato:	article
Lenguaje:	EN
Publicado:	Japanese Society of Tribologists 2008
Materias:	a-c:h surface undulation wetting angle adhesion force real area of contact Physics QC1-999 Engineering (General). Civil engineering (General) TA1-2040 Mechanical engineering and machinery TJ1-1570 Chemistry QD1-999
Acceso en línea:	https://doaj.org/article/d194fbd24a5d4260ad749601404374b2
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id	oai:doaj.org-article:d194fbd24a5d4260ad749601404374b2
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spelling	oai:doaj.org-article:d194fbd24a5d4260ad749601404374b22021-11-05T09:28:53ZWetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces1881-219810.2474/trol.3.294https://doaj.org/article/d194fbd24a5d4260ad749601404374b22008-10-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/trol/3/5/3_5_294/_pdf/-char/enhttps://doaj.org/toc/1881-2198The wetting and adhesion properties of undulated a-C:H surfaces were investigated. The nano-undulated a-C:H films were prepared by radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD) using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM and AFM analysis showed that the surface had nanoscale undulations. Raman spectra of film showed that the plasma induced damage with Ar ions significantly suppressed the graphitization of a-C:H structure. Also, it was observed that the untreated flat a-C:H surfaces had a water wetting angle of 72° and adhesion force of 333 nN. After the treatment for the undulated a-C:H surfaces whose surface morphologies change to an array of pillar asperities, its wetting angle of water increased up to 104° and adhesion force decreased down to 11 nN. These results agree with the estimation of real area of contact on the basis of Hertz and JKR adhesion models. The effect of the surface undulation treatment was discussed with the following factors: the surface morphology affinity to pillar shape, a reduction of the real area of contact and air pockets trapped in pillar double asperities of the surface.Young-Jun JangNorisugu UmeharaJapanese Society of Tribologistsarticlea-c:hsurface undulationwetting angleadhesion forcereal area of contactPhysicsQC1-999Engineering (General). Civil engineering (General)TA1-2040Mechanical engineering and machineryTJ1-1570ChemistryQD1-999ENTribology Online, Vol 3, Iss 5, Pp 294-297 (2008)
institution	DOAJ
collection	DOAJ
language	EN
topic	a-c:h surface undulation wetting angle adhesion force real area of contact Physics QC1-999 Engineering (General). Civil engineering (General) TA1-2040 Mechanical engineering and machinery TJ1-1570 Chemistry QD1-999
spellingShingle	a-c:h surface undulation wetting angle adhesion force real area of contact Physics QC1-999 Engineering (General). Civil engineering (General) TA1-2040 Mechanical engineering and machinery TJ1-1570 Chemistry QD1-999 Young-Jun Jang Norisugu Umehara Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces
description	The wetting and adhesion properties of undulated a-C:H surfaces were investigated. The nano-undulated a-C:H films were prepared by radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD) using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM and AFM analysis showed that the surface had nanoscale undulations. Raman spectra of film showed that the plasma induced damage with Ar ions significantly suppressed the graphitization of a-C:H structure. Also, it was observed that the untreated flat a-C:H surfaces had a water wetting angle of 72° and adhesion force of 333 nN. After the treatment for the undulated a-C:H surfaces whose surface morphologies change to an array of pillar asperities, its wetting angle of water increased up to 104° and adhesion force decreased down to 11 nN. These results agree with the estimation of real area of contact on the basis of Hertz and JKR adhesion models. The effect of the surface undulation treatment was discussed with the following factors: the surface morphology affinity to pillar shape, a reduction of the real area of contact and air pockets trapped in pillar double asperities of the surface.
format	article
author	Young-Jun Jang Norisugu Umehara
author_facet	Young-Jun Jang Norisugu Umehara
author_sort	Young-Jun Jang
title	Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces
title_short	Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces
title_full	Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces
title_fullStr	Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces
title_full_unstemmed	Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces
title_sort	wetting and adhesion behaviors of a-c:h film deposited on nano-scale copper doted surfaces
publisher	Japanese Society of Tribologists
publishDate	2008
url	https://doaj.org/article/d194fbd24a5d4260ad749601404374b2
work_keys_str_mv	AT youngjunjang wettingandadhesionbehaviorsofachfilmdepositedonnanoscalecopperdotedsurfaces AT norisuguumehara wettingandadhesionbehaviorsofachfilmdepositedonnanoscalecopperdotedsurfaces
_version_	1718444377668321280

Wetting and Adhesion Behaviors of a-C:H Film Deposited on Nano-Scale Copper Doted Surfaces

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