Advanced 3D Integration Technologies in Various Quantum Computing Devices

As a key approach to augment Moore's Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computi...

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Enregistré dans:
Détails bibliographiques
Auteurs principaux: Peng Zhao, Yu Dian Lim, Hong Yu Li, Guidoni Luca, Chuan Seng Tan
Format: article
Langue:EN
Publié: IEEE 2021
Sujets:
TSV
Accès en ligne:https://doaj.org/article/d509d3cd39ff439387c5c0a2cd6a8a39
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