Advanced 3D Integration Technologies in Various Quantum Computing Devices

As a key approach to augment Moore's Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computi...

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Autores principales:	Peng Zhao, Yu Dian Lim, Hong Yu Li, Guidoni Luca, Chuan Seng Tan
Formato:	article
Lenguaje:	EN
Publicado:	IEEE 2021
Materias:	3D integration 3D packaging TSV flip-chip ion trap superconducting circuit Chemical technology TP1-1185 Electrical engineering. Electronics. Nuclear engineering TK1-9971
Acceso en línea:	https://doaj.org/article/d509d3cd39ff439387c5c0a2cd6a8a39
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id	oai:doaj.org-article:d509d3cd39ff439387c5c0a2cd6a8a39
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spelling	oai:doaj.org-article:d509d3cd39ff439387c5c0a2cd6a8a392021-11-19T00:07:15ZAdvanced 3D Integration Technologies in Various Quantum Computing Devices2644-129210.1109/OJNANO.2021.3124363https://doaj.org/article/d509d3cd39ff439387c5c0a2cd6a8a392021-01-01T00:00:00Zhttps://ieeexplore.ieee.org/document/9599482/https://doaj.org/toc/2644-1292As a key approach to augment Moore's Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computing devices which are at the nascent stage and generally require large scale integration to be practical. In this review, we focus on four popular quantum bit (qubit) candidates (trapped ion, superconducting circuit, silicon spin and photon) which are encoded by distinct physical systems but all intrinsically compatible with advanced CMOS fabrication process. We introduce the specific scalability bottlenecks of each qubit type and present the current solutions using 3D integration technologies. We evaluate and classify these technologies into three main categories based on the hierarchy. A brief discussion regarding the thermal management is also provided. We believe this review serves to provide some useful insights on the contributions of interconnect, integration and packaging to the field of quantum computing where rapid development is ongoing.Peng ZhaoYu Dian LimHong Yu LiGuidoni LucaChuan Seng TanIEEEarticle3D integration3D packagingTSVflip-chipion trapsuperconducting circuitChemical technologyTP1-1185Electrical engineering. Electronics. Nuclear engineeringTK1-9971ENIEEE Open Journal of Nanotechnology, Vol 2, Pp 101-110 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	3D integration 3D packaging TSV flip-chip ion trap superconducting circuit Chemical technology TP1-1185 Electrical engineering. Electronics. Nuclear engineering TK1-9971
spellingShingle	3D integration 3D packaging TSV flip-chip ion trap superconducting circuit Chemical technology TP1-1185 Electrical engineering. Electronics. Nuclear engineering TK1-9971 Peng Zhao Yu Dian Lim Hong Yu Li Guidoni Luca Chuan Seng Tan Advanced 3D Integration Technologies in Various Quantum Computing Devices
description	As a key approach to augment Moore's Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computing devices which are at the nascent stage and generally require large scale integration to be practical. In this review, we focus on four popular quantum bit (qubit) candidates (trapped ion, superconducting circuit, silicon spin and photon) which are encoded by distinct physical systems but all intrinsically compatible with advanced CMOS fabrication process. We introduce the specific scalability bottlenecks of each qubit type and present the current solutions using 3D integration technologies. We evaluate and classify these technologies into three main categories based on the hierarchy. A brief discussion regarding the thermal management is also provided. We believe this review serves to provide some useful insights on the contributions of interconnect, integration and packaging to the field of quantum computing where rapid development is ongoing.
format	article
author	Peng Zhao Yu Dian Lim Hong Yu Li Guidoni Luca Chuan Seng Tan
author_facet	Peng Zhao Yu Dian Lim Hong Yu Li Guidoni Luca Chuan Seng Tan
author_sort	Peng Zhao
title	Advanced 3D Integration Technologies in Various Quantum Computing Devices
title_short	Advanced 3D Integration Technologies in Various Quantum Computing Devices
title_full	Advanced 3D Integration Technologies in Various Quantum Computing Devices
title_fullStr	Advanced 3D Integration Technologies in Various Quantum Computing Devices
title_full_unstemmed	Advanced 3D Integration Technologies in Various Quantum Computing Devices
title_sort	advanced 3d integration technologies in various quantum computing devices
publisher	IEEE
publishDate	2021
url	https://doaj.org/article/d509d3cd39ff439387c5c0a2cd6a8a39
work_keys_str_mv	AT pengzhao advanced3dintegrationtechnologiesinvariousquantumcomputingdevices AT yudianlim advanced3dintegrationtechnologiesinvariousquantumcomputingdevices AT hongyuli advanced3dintegrationtechnologiesinvariousquantumcomputingdevices AT guidoniluca advanced3dintegrationtechnologiesinvariousquantumcomputingdevices AT chuansengtan advanced3dintegrationtechnologiesinvariousquantumcomputingdevices
_version_	1718420638646927360

Advanced 3D Integration Technologies in Various Quantum Computing Devices

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