Advanced 3D Integration Technologies in Various Quantum Computing Devices

As a key approach to augment Moore's Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computi...

Full description

Saved in:
Bibliographic Details
Main Authors: Peng Zhao, Yu Dian Lim, Hong Yu Li, Guidoni Luca, Chuan Seng Tan
Format: article
Language:EN
Published: IEEE 2021
Subjects:
TSV
Online Access:https://doaj.org/article/d509d3cd39ff439387c5c0a2cd6a8a39
Tags: Add Tag
No Tags, Be the first to tag this record!