ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

Zero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gyroscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work, we conduct an elaborate investigation on the impac...

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Autores principales:	Pengfei Xu, Zhenyu Wei, Lu Jia, Yongmei Zhao, Guowei Han, Chaowei Si, Jin Ning, Fuhua Yang
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	ZRO drift MEMS gyroscope internal and packaging stresses finite element analysis stress release Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/d544619cd6784b18a37392f70c99e302
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spelling	oai:doaj.org-article:d544619cd6784b18a37392f70c99e3022021-11-25T18:23:10ZZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release10.3390/mi121113292072-666Xhttps://doaj.org/article/d544619cd6784b18a37392f70c99e3022021-10-01T00:00:00Zhttps://www.mdpi.com/2072-666X/12/11/1329https://doaj.org/toc/2072-666XZero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gyroscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work, we conduct an elaborate investigation on the impacts of the internal and packaging stresses on the ZRO drift at the thermal start-up stage and propose a temperature-induced stress release method to reduce the duration and magnitude of ZRO drift. Self-developed high-Q dual-mass tuning fork gyroscopes (TFGs) are adopted to study the correlations between temperature, frequency, and ZRO drift. Furthermore, a rigorous finite element simulation model is built based on the actual device and packaging structure, revealing the temperature and stresses distribution inside TFGs. Meanwhile, the relationship between temperature and stresses are deeply explored. Moreover, we introduce a temperature-induced stress release process to generate thermal stresses and reduce the temperature-related device sensitivity. By this way, the ZRO drift duration is drastically reduced from ~2000 s to ~890 s, and the drift magnitude decreases from ~0.4 °/s to ~0.23 °/s. The optimized device achieves a small bias instability (BI) of 7.903 °/h and a low angle random walk (ARW) of 0.792 °/√ h, and its long-term bias performance is significantly improved.Pengfei XuZhenyu WeiLu JiaYongmei ZhaoGuowei HanChaowei SiJin NingFuhua YangMDPI AGarticleZRO driftMEMS gyroscopeinternal and packaging stressesfinite element analysisstress releaseMechanical engineering and machineryTJ1-1570ENMicromachines, Vol 12, Iss 1329, p 1329 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	ZRO drift MEMS gyroscope internal and packaging stresses finite element analysis stress release Mechanical engineering and machinery TJ1-1570
spellingShingle	ZRO drift MEMS gyroscope internal and packaging stresses finite element analysis stress release Mechanical engineering and machinery TJ1-1570 Pengfei Xu Zhenyu Wei Lu Jia Yongmei Zhao Guowei Han Chaowei Si Jin Ning Fuhua Yang ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release
description	Zero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gyroscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work, we conduct an elaborate investigation on the impacts of the internal and packaging stresses on the ZRO drift at the thermal start-up stage and propose a temperature-induced stress release method to reduce the duration and magnitude of ZRO drift. Self-developed high-Q dual-mass tuning fork gyroscopes (TFGs) are adopted to study the correlations between temperature, frequency, and ZRO drift. Furthermore, a rigorous finite element simulation model is built based on the actual device and packaging structure, revealing the temperature and stresses distribution inside TFGs. Meanwhile, the relationship between temperature and stresses are deeply explored. Moreover, we introduce a temperature-induced stress release process to generate thermal stresses and reduce the temperature-related device sensitivity. By this way, the ZRO drift duration is drastically reduced from ~2000 s to ~890 s, and the drift magnitude decreases from ~0.4 °/s to ~0.23 °/s. The optimized device achieves a small bias instability (BI) of 7.903 °/h and a low angle random walk (ARW) of 0.792 °/√ h, and its long-term bias performance is significantly improved.
format	article
author	Pengfei Xu Zhenyu Wei Lu Jia Yongmei Zhao Guowei Han Chaowei Si Jin Ning Fuhua Yang
author_facet	Pengfei Xu Zhenyu Wei Lu Jia Yongmei Zhao Guowei Han Chaowei Si Jin Ning Fuhua Yang
author_sort	Pengfei Xu
title	ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release
title_short	ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release
title_full	ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release
title_fullStr	ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release
title_full_unstemmed	ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release
title_sort	zro drift reduction of mems gyroscopes via internal and packaging stress release
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/d544619cd6784b18a37392f70c99e302
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ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

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