Investigation of heat transfer phenomena and flow behavior around electronic chip
Computational study of three-dimensional laminar and turbulent flows around electronic chip (heat source) located on a printed circuit board are presented. Computational field involves the solution of elliptic partial differential equations for conservation of mass, momentum, energy, turbulent ener...
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Formato: | article |
Lenguaje: | EN |
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Al-Khwarizmi College of Engineering – University of Baghdad
2007
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Acceso en línea: | https://doaj.org/article/d9c84fc3e43948d28e9042061dcc9548 |
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