Investigation of heat transfer phenomena and flow behavior around electronic chip

Computational study of three-dimensional laminar and turbulent flows around electronic chip (heat source) located on a printed circuit board are presented. Computational field involves the solution of elliptic partial differential equations for conservation of mass, momentum, energy, turbulent ener...

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Autor principal:	Sattar j. Habeeb
Formato:	article
Lenguaje:	EN
Publicado:	Al-Khwarizmi College of Engineering – University of Baghdad 2007
Materias:	Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040
Acceso en línea:	https://doaj.org/article/d9c84fc3e43948d28e9042061dcc9548
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spelling	oai:doaj.org-article:d9c84fc3e43948d28e9042061dcc95482021-12-02T04:15:15ZInvestigation of heat transfer phenomena and flow behavior around electronic chip1818-11712312-0789https://doaj.org/article/d9c84fc3e43948d28e9042061dcc95482007-06-01T00:00:00Zhttp://alkej.uobaghdad.edu.iq/index.php/alkej/article/view/625https://doaj.org/toc/1818-1171https://doaj.org/toc/2312-0789 Computational study of three-dimensional laminar and turbulent flows around electronic chip (heat source) located on a printed circuit board are presented. Computational field involves the solution of elliptic partial differential equations for conservation of mass, momentum, energy, turbulent energy, and its dissipation rate in finite volume form. The k-ε turbulent model was used with the wall function concept near the walls to treat of turbulence effects. The SIMPLE algorithm was selected in this work. The chip is cooled by an external flow of air. The goals of this investigation are to investigate the heat transfer phenomena of electronic chip located in enclosure and how we arrive to optimum level for cooling of this chip. These parameters, which will help enhance thermal performance of electronic chip and flow patterns, through the understanding of different factors on flow patterns. The results show the relation between the temperature rise, heat transfer parameters (Nu, Ra) with (Ar, Q) for two cases of laminar and turbulent flows. Sattar j. HabeebAl-Khwarizmi College of Engineering – University of BaghdadarticleChemical engineeringTP155-156Engineering (General). Civil engineering (General)TA1-2040ENAl-Khawarizmi Engineering Journal, Vol 3, Iss 2 (2007)
institution	DOAJ
collection	DOAJ
language	EN
topic	Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040
spellingShingle	Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040 Sattar j. Habeeb Investigation of heat transfer phenomena and flow behavior around electronic chip
description	Computational study of three-dimensional laminar and turbulent flows around electronic chip (heat source) located on a printed circuit board are presented. Computational field involves the solution of elliptic partial differential equations for conservation of mass, momentum, energy, turbulent energy, and its dissipation rate in finite volume form. The k-ε turbulent model was used with the wall function concept near the walls to treat of turbulence effects. The SIMPLE algorithm was selected in this work. The chip is cooled by an external flow of air. The goals of this investigation are to investigate the heat transfer phenomena of electronic chip located in enclosure and how we arrive to optimum level for cooling of this chip. These parameters, which will help enhance thermal performance of electronic chip and flow patterns, through the understanding of different factors on flow patterns. The results show the relation between the temperature rise, heat transfer parameters (Nu, Ra) with (Ar, Q) for two cases of laminar and turbulent flows.
format	article
author	Sattar j. Habeeb
author_facet	Sattar j. Habeeb
author_sort	Sattar j. Habeeb
title	Investigation of heat transfer phenomena and flow behavior around electronic chip
title_short	Investigation of heat transfer phenomena and flow behavior around electronic chip
title_full	Investigation of heat transfer phenomena and flow behavior around electronic chip
title_fullStr	Investigation of heat transfer phenomena and flow behavior around electronic chip
title_full_unstemmed	Investigation of heat transfer phenomena and flow behavior around electronic chip
title_sort	investigation of heat transfer phenomena and flow behavior around electronic chip
publisher	Al-Khwarizmi College of Engineering – University of Baghdad
publishDate	2007
url	https://doaj.org/article/d9c84fc3e43948d28e9042061dcc9548
work_keys_str_mv	AT sattarjhabeeb investigationofheattransferphenomenaandflowbehavioraroundelectronicchip
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Investigation of heat transfer phenomena and flow behavior around electronic chip

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