Processing-Structure-Protrusion Relationship of 3-D Cu TSVs: Control at the Atomic Scale
A phase-field-crystal model is used to investigate the processing-structure-protrusion relationship of blind Cu through-silicon vias (TSVs) at the atomic scale. A higher temperature results in a larger TSV protrusion. Deformation via dislocation motion dominates at temperatures lower than around 300...
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| Auteurs principaux: | , , , |
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| Format: | article |
| Langue: | EN |
| Publié: |
IEEE
2019
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| Sujets: | |
| Accès en ligne: | https://doaj.org/article/e9f3d9c867ef430c93bc5047a31fc0f9 |
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