Cita APA (7a ed.)

Liu, J., Huang, Z., Conway, P. P., & Liu, Y. (2019). Processing-Structure-Protrusion Relationship of 3-D Cu TSVs: Control at the Atomic Scale. IEEE.

Cita Chicago Style (17a ed.)

Liu, Jinxin, Zhiheng Huang, Paul P. Conway, y Yang Liu. Processing-Structure-Protrusion Relationship of 3-D Cu TSVs: Control at the Atomic Scale. IEEE, 2019.

Cita MLA (8a ed.)

Liu, Jinxin, et al. Processing-Structure-Protrusion Relationship of 3-D Cu TSVs: Control at the Atomic Scale. IEEE, 2019.